Heat spreader device

ABSTRACT

A device for transferring heat from a device component to an environment includes a heat plate connected to a spring. A first fastener attaches the spring to the heat plate at a first location. A second fastener, such as a rivet, attaches the spring to the heat plate at each of a second and a third location. The second fastener includes a tab on and extending above the heat plate and corresponding tab slot on the spring. The spring is riveted to the heat plate at the first location and a second spring member accepts the tab at each of the second location and the third location. Ribs on a top surface of spring facilitate thermal coupling of the spring to the component when the device is assembled. One or more spring curvatures facilitate vertical deflection and horizontal extension of the spring during device assembly.

CROSS-REFERENCE TO RELATED APPLICTIONS

The present application is a divisional application of and claimspriority to U.S. application Ser. No. 15/729,866, filed on Oct. 11,2017, in the name of inventor Lana Trygubova, and entitled “HeatSpreader Assembly,” the entire contents of which are incorporated hereinby reference.

TECHNICAL FIELD

The technology described herein generally relates to devices, systems,and methods for transferring heat from a component in an electronicdevice. More particularly, the various embodiments disclosed hereingenerally relate to heat spreader assemblies configured to transfer heatfrom microprocessors, memory devices, and other components in electronicdevices to an external environment. More specifically, the variousembodiments disclosed generally relate to a heat spreader configured toadjust to variances in enclosure designs and device heights to providesufficient physical and/or thermal contact between a heat transfercomponent and a heat generating component when an enclosure for thedevice is in an assembled configuration.

BACKGROUND

Devices, including electronic devices such as set-top box assemblies,computers, smart phones, vehicle control systems, and others, commonlyinclude one or more components that generate a heat. Such heat oftenneeds to be transferred away from such component (hereafter, a“component” or a “heat generating component”) to facilitate desireoperating conditions for the component. Such heat transfer may oftenoccur by use of thermal conduction between the component and a heatplate or similar assembly, where the heat plate is configured to furthertransfer the heat received from the component into an internal orexternal environment or to other components. Commonly, the heat plateuses thermal transfer mechanisms such as conduction, convection,radiation, evaporative cooling, active cooling, and other approachesknown in the art for transferring heat.

More specifically, one approach for heat transfer in devices is to use aheat plate assembly to conduct heat away from one or more components inthe device and across a wider area to enhance convective heatdissipation. Such a heat plate assembly often extends across asubstantial portion of one or more of a device's surface enclosures,such as across a top enclosure, a side enclosure, or a bottom enclosure.The one or more heat plate assemblies are often configured to contactone or more heat generating components in the device, while often notcontacting other non-heat generating components. That is, the heat plateassembly is often configured to transfer heat away from the one or moreheat generating components and not transfer such heat to othercomponents. Often the heat plate assembly needs to establish a firmcontact with a heat generating component to transfer heat efficientlyand effectively. Yet, such heat plate assemblies are often configuredinto and/or onto an enclosure of the device, which when in an openconfiguration does not contact the heat generating component and, whenthe device is in a closed or assembled configuration, does not directlycontact the heat generating component without the use of interveningmembers.

Further, wide variances often exist between physical devices and designtolerances. That is, component heights, gaps between enclosure surfacesoften materialize during manufacturing that present challenges inestablishing the desired contact between a heat plate assembly and agiven heat generating components. To bridge such gaps while consideringthe above mentioned and other deviations between design and actualdevices, a spring or similar assembly is often used. Examples of uses ofsuch spring members can be found, for example in U.S. Patent Publication20170196121, entitled “Self-Adjustable Heat Spreader System for Set-TopBox Assemblies”, which published on Jul. 6, 2017, in the name ofinventors Trygubova et al., the entire contents of which areincorporated herein by references.

Accordingly, various approaches are known wherein one or more flexiblemembers, or spring-like materials, may be used to bridge gaps andprovide a bridge between a component and a heat plate or similarassembly. Such flexible members commonly are referred at heat spreadersand are configured to extend outwards from a heat plate assembly to fillan often-variable gap between a surface of the enclosure and a heatgenerating component and, when the device is in an assembledconfiguration, without extending undue force or pressure onto thecontacted surface of the heat generating component. Yet, presentlyavailable heat spreaders suffer from numerous deficiencies.

First, heat spreaders commonly include springs or similar assembliesthat are fixed to a heat plate. Such fixed springs do not permitmovement of the spring relative to the heat plate other than by bendingor warping of the spring member. When so deflected during closing of thedevice enclosure, a warped or uneven contact area between the spring ofthe heat spreader and the contacted surface of the heat generatingmember often occurs. Such uneven contact often decreases theeffectiveness and efficiency of heat transfer.

Second, to prevent such uneven and/or warped springs from occurring,current designs commonly use a center block area that has an enlargedcenter block area. The enlarged center block is configured so as toprevent warping or bending of the spring at and near the desired contactarea of the spring with the component. Yet, the use of enlarged centerblock areas often results in design configurations that are wasteful ofmaterial, undesired and/or non-controlled bending or warping of thespring elsewhere, and prevent convective cooling of the component atand/or about the contact area between the heat generating component andthe heat spreader itself.

Accordingly, a need exists for heat spreaders having springs or similarassemblies that address the above and other concerns. These and otherneeds are addressed by the present disclosure.

SUMMARY

The various embodiments of the present disclosure relate in general toheat spreaders configured for use with heat plate assemblies to conductheat away from heat generating components in electronic devices. Thevarious embodiments also relate to heat plate assemblies that includeone or more of the heat spreaders of the present disclosure. The variousembodiments also relate to electronic devices that include and use oneor more of the heat spreaders of the present disclosure to conduct heataway from a heat generating component in the electronic device, whensuch device is in use and at any time arising before or after use.

In accordance with at least one embodiment of the present disclosure aheat spreader, for use in a device, includes a spring, coupled to a heatplate. For at least one embodiment, the spring may include a firstspring member configured to attach to the spring to the heat plate at afirst location and a second spring member, connected to the first springmember. The second spring member may be configured to attach the springto the heat plate along a second location when the device is in anunassembled state and at a third location when the device is in anassembled state. For at least one embodiment, the heat plate may includea first fastener configured to attach the spring to the heat plate atthe first location and a second fastener configured to attach the secondspring member to the heat plate at and between each of the secondlocation and a third location. For at least one embodiment, a heatspreader may include a second fastener configured as a tab extendingabove a top surface of the heat plate and between the second locationand a third location.

For at least one embodiment, a heat spreader may include a second springmember having a tab slot configured to accept a tab at each of a secondlocation and a third location.

For at least one embodiment, a heat spreader may include a tab slotpositioned at a second location when the device is in an unassembledstate.

For at least one embodiment, a heat spreader may include a tab slotpositioned at a third location when the device is in the assembledstate.

For at least one embodiment, a heat spreader may include a firstfastener configured as a rivet.

For at least one embodiment, a heat spreader may include a top springmember connected to each of a first spring member and a second springmember and configured to contact a top surface of a component in thedevice when the device is in an assembled state.

For at least one embodiment, a heat spreader may include a spring havinga first connecting member connecting a first spring member to a topspring member and a second connecting member connecting the top springmember to a second spring member.

For at least one embodiment, a heat spreader may include a firstconnecting member having a first spring curvature and a second springcurvature. For at least one embodiment, the second connecting memberincludes a third spring curvature and a fourth spring curvature.

For at least one embodiment, a heat spreader when in an assembled stateincludes a spring that is vertically deflected about each of a firstspring curvature and a third spring curvature.

For at least one embodiment, a heat spreader when in an assembled stateincludes a spring that is horizontally extended about each of a secondspring curvature and a fourth spring curvature.

For at least one embodiment, a heat spreader includes a top springmember having at least two ribs.

For at least one embodiment, a heat spreader includes a thermal padattached. For at least one embodiment, the thermal pad is attached to atop spring member and configured to facilitate heat transfer from acomponent of a device when the device is in the assembled state.

In accordance with at least one embodiment of the present disclosure, aheat spreader, for use in a device, includes: a heat plate; and a springconnected to the heat plate. For at least one embodiment, the heat plateincludes: a first fastener configured to attach a spring to the heatplate at a first location; and a second fastener, configured to attachthe spring to the heat plate at and between each of a second locationand a third location.

For at least one embodiment, the second fastener may be a tab extendingabove a top surface of the heat plate and between the second locationand the third location. For at least one embodiment, the spring mayinclude a first spring member configured to attach the spring to theheat plate at the first location and a second spring member.

For at least one embodiment, the second spring member may include a tabslot configured to accept the tab at each of the second location and thethird location and attach the spring to the heat plate at the secondlocation when the device is in an unassembled state and at the thirdlocation when the device is in an assembled state.

For at least one embodiment, a top spring member may include: at leasttwo ribs configured to contact a top surface of a component in thedevice when the device is in the assembled state; a first connectingmember, connecting the first spring member to the top spring member,having at least a first spring curvature and a second spring curvature;and, a second connecting member, connecting the top spring member to thesecond spring member, having at least a third spring curvature and afourth spring curvature. For at least one embodiment and when the deviceis in the assembled state, the spring may be vertically deflected by adeflection of at least one the first spring curvature and the thirdspring curvature. For at least one embodiment and when the device is inthe assembled state, the spring may be horizontally extended by anextension of at least one of the second spring curvature and the fourthspring curvature.

For at least one embodiment a heat spreader may include a thermal padattached to the a spring member and configured to facilitate heattransfer from a component when the device is in the assembled state. Forat least one embodiment a heat spreader may include use of a fastener.For at least one embodiment, the fastener is a rivet.

For at least one embodiment a heat spreader may include a rivet opening.For at least one embodiment a heat spreader may include a rivet toolopening.

In accordance with at least one embodiment of the present disclosure, amethod of assembling a device may include the operation of positioning aheat spreader in a first enclosure of a device while the device is in anunassembled state.

In accordance with at least one embodiment of the present disclosure, amethod of assembling a device may include the operation of attaching aspring to a heat plate. For at least one embodiment, the spring mayinclude a top spring member.

For at least one embodiment, a method of assembling a device may includethe operation of, prior to the positioning of a heat spreader in a firstenclosure, attached a spring to the heat plate at a first location andat a second location. For at least one embodiment, attachment of thespring to the heat plate at the first location and at the secondlocation results in an alignment of a top spring member with a topsurface of a component in the device while the device is each of theunassembled and in an assembled state.

For at least one embodiment, a method of assembling a device may includethe operation of lowering a first enclosure towards a second enclosureof a device.

For at least one embodiment, the method may include use of a springconfigured to vertically deflect and horizontally extend as contact ismade between a top spring member and a top surface of a component whilethe device is assembled.

For at least one embodiment, the operation of lowering of a firstenclosure towards a second enclosure of a device results in a verticaldeflection of a spring. For at least one embodiment, the operation oflowering a first enclosure towards the second enclosure results in ahorizontal extension of a spring.

For at least one embodiment, upon the vertical deflection and horizontalextension of a spring, a top spring member is thermally connected to atop surface of a component. For at least one embodiment, a method ofassembling a device may include the operation of securing the firstenclosure to the second enclosure.

For at least one embodiment, a method of assembling a device may includethe use of a spring having a first connecting member and a secondconnecting member. For at least one embodiment, a method of assembling adevice may result in a vertical deflection of a spring. For at least oneembodiment, the vertical deflection may occur along at least one of afirst connecting member and a second connecting member.

For at least one embodiment, a method of assembling a device may resultin a horizontal extension of the spring. For at least one embodiment,the horizontal extension may occur along at least one of a firstconnecting member and a second connecting member. For at least oneembodiment, a method of assembling a device may include the operation ofattaching a thermal pad to a top spring member. For at least oneembodiment, the thermal pad may be configured to transfer heat from acomponent to the spring when a device is in an assembled state.

BRIEF DESCRIPTION OF THE DRAWINGS

The features, aspects, advantages, functions, modules, and components ofthe devices, systems and methods provided by the various embodiments ofthe present disclosure are further disclosed herein regarding at leastone of the following descriptions and accompanying drawing figures. Inthe appended figures, similar components or elements of the same typemay have the same reference number, such as 108, with an additionalalphabetic designator, such as 108 a, 108 n, etc., wherein thealphabetic designator indicates that the components bearing the samereference number, e.g., 108, share common properties and/orcharacteristics. Further, various views of a component may bedistinguished by a first reference label followed by a dash and a secondreference label, wherein the second reference label is used for purposesof this description to designate a view of the component. When only thefirst reference label is used in the specification, the description isapplicable to any of the similar components and/or views having the samefirst reference number irrespective of any additional alphabeticdesignators or second reference labels, if any.

FIG. 1A is a top view of an assembled heat spreader in accordance withat least one embodiment of the present disclosure.

FIG. 1B is a cross-section view of the heat spreader of FIG. 1A takenalong line 1B-1B of FIG. 1A and in accordance with at least oneembodiment of the present disclosure.

FIG. 1C is a bottom view of the heat spreader of FIG. 1A in accordancewith at least one embodiment of the present disclosure.

FIG. 1D is a top perspective view of the heat spreader of FIG. 1A inaccordance with at least one embodiment of the present disclosure.

FIG. 1E is a cross-sectional view of the heat spreader of FIG. 1A takenalong line 1E-1E of FIG. 1A and in accordance with at least oneembodiment of the present disclosure.

FIG. 1F is an enlarged view of the area indicated by circle 1F in FIG.1E for the heat spreader of FIG. 1A and in accordance with at least oneembodiment of the present disclosure.

FIG. 1G is an enlarged view of the area indicated by circle 1G in FIG.1E for the heat spreader of FIG. 1A and in accordance with at least oneembodiment of the present disclosure.

FIG. 2A is a top view of a heat plate member of a heat spreader and inaccordance with at least one embodiment of the present disclosure.

FIG. 2B is a left side view of the heat plate member of FIG. 2A and inaccordance with at least one embodiment of the present disclosure.

FIG. 2C is a bottom view of the heat plate member of FIG. 2A and inaccordance with at least one embodiment of the present disclosure.

FIG. 2D is a cross-section view of the heat plate member FIG. 2A and inaccordance with at least one embodiment of the present disclosure.

FIG. 2E is a top perspective view of the heat plate member of FIG. 2Aand in accordance with at least one embodiment of the presentdisclosure.

FIG. 3A is a top view of a spring member and in accordance with at leastone embodiment of the present disclosure.

FIG. 3B is a bottom view of the spring member of FIG. 3A and inaccordance with at least one embodiment of the present disclosure.

FIG. 3C is a cross-section view of the spring member of FIG. 3A and inaccordance with at least one embodiment of the present disclosure.

FIG. 3D is a bottom perspective view of a spring member of FIG. 3A andin accordance with at least one embodiment of the present disclosure.

FIG. 3E is a left-side view of the spring member FIG. 3A in accordancewith at least one embodiment of the present disclosure.

FIG. 3F is a right-side view of the spring member of FIG. 3A and inaccordance with at least one embodiment of the present disclosure.

FIG. 4A is a partial cross-sectional view of a device, having a heatspreader configured in accordance with at last one embodiment of thepresent disclosure, where the device is in an unassembled state.

FIG. 4B is a partial cross-sectional view of a device, having a heatspreader configured in accordance with at last one embodiment of thepresent disclosure, where the device is in an assembled state.

DETAILED DESCRIPTION

The various embodiments described herein are directed to devices,systems, and methods for using a heat spreader that is configured totransfer heat away from a heat generating component in an electronicdevice or other device using a heat plate or similar assembly and atleast one spring. Such heat spreaders of the present disclosure may beconfigured to fill a gap that may otherwise arise between a heat platesituated on or about an enclosure of a device and a heat generatingcomponent in such device. The device may be any type of device thatgenerates heat and where such heat may be transferred to the deviceelsewhere using an embodiment of the heat spreader of the presentdisclosure. Non-limiting examples of such devices include computers,set-top boxes, televisions, smart-phones, automobile electronics, andothers. The one or more embodiments of such a heat spreader may beconfigured to improve the efficiency of the device by improving thethermal control properties of such device. It is to be appreciated, thatimprovements in thermal control, for a device, may result inimprovements in power, energy use, operating characteristics, andotherwise.

As shown in FIGS. 1A to 1G and in accordance with at least oneembodiment of the present disclosure, a heat spreader 100 for use in adevice 400, as shown in FIG. 4A, to transfer heat away from a componentin such device and into an environment includes a heat plate 102, asfurther shown in FIGS. 2A-2E, that is mechanically and thermally coupledto a spring 104, as further shown in FIGS. 3A-3E. It is to beappreciated that heat may be transferred to/from the component via thespring 104 and heat plate 102 into an environment 404 internal to thedevice 400 and/or to an environment external to the device 400, asdesired for any given implementation of an embodiment of the presentdisclosure. Such heat transfer may occur by use of well-knownthermodynamic principles including thermal conduction, convection,radiation, combinations thereof, and otherwise. A person having ordinaryskill in the art will appreciate that active and/or passive thermalcontrol technologies may be used in conjunction with the heat plate.

The heat plate 102 has a top surface 102-T, as shown in FIG. 1A, and abottom surface 102-B, as shown in FIG. 1C. For at least one embodiment,the heat plate 102 may include a substantially flat surface. For otherembodiments, the heat plate 102 may have any suitable form.

The heat plate 102 may be sized to accommodate the heat transferproperties desired for a given device 400, as shown in FIGS. 4A and 4B,and/or one or more heat generating components 402 thereof. The heatplate 102 may be configured to abut an enclosure, such as a topenclosure 408, or other member of a device 400, and to receive heatconducted from a component 402 in the device 400, using at least thespring 104. The heat plate 102 may be configured to transfer the heattransferred to hit, via the spring 104, from the component 402 to aninternal or external environment and/or to other components in a device400, such as component 414. It is to be appreciated that such components402 and 414 may mechanically, thermally, and/or electricallyinterconnected by use of printed circuit boards (PCBs) 412, wiring, orother known structures. Accordingly, the transfer of heat by use of anembodiment of a heat spreader 100 of the present disclosure is notintended for use only with the transfer of heat arising from any single,given component, such as component 402. As desired for any givenimplementation of an embodiment of the present disclosure, heat spreader100 may be used for any transfer of heat to/from/within or without adevice, by using principles of conduction and convection, radiation orotherwise. Further, such heat transfer may occur throughout and/or outof the device, as desired for any given embodiment. It is to beappreciated that the heat plate 102 may also be configured to transferheat from one or more heat generating components in a device to one ormore heat absorbing components in a device. The use of a heat plate 102is accordingly not to be construed as being limited for only thetransfer heat from a component 402 and out of a device, but is also tobe considered as being applicable to any desired transfer of heatthrough, in and/or out of a device.

In at least one embodiment, the heat plate 102 is constructed of platealuminum and has a first thickness D1. For at least one embodiment, D1equals 1.0 mm. In other embodiments, other materials and/or thicknessesthereof may be utilized to facilitate heat transfer in a device. Suchmaterials and their respective heat transfer properties are well knownin the art and are not described further herein.

The heat plate 102 may be configured to include one or more rivets105A/105B at respective one or more first locations, such as locationsL1A and L1 shown in FIG. 2A. It is to be appreciated that the one ormore first locations may be located anywhere on the heat plate 102, asdesired for an implementation of any given embodiment of the presentdisclosure. The rivets 105A/105B may be aligned in one or moredirections. For at least one embodiment, the rivets 105 may be used tomechanically connect the spring 104 to the heat plate 102. For at leastone embodiment, the rivets 105 may be configured to thermally couple thespring 104 to the heat plate 102. The sizing of the rivets 105 may varybased upon the size of the spring 104, the anticipated amount ofvertical, horizontal, and/or shear forces imparted on the spring 104when in one or more of various states, as described below, and in viewof other factors known in the art, such as the heat conductiveproperties of materials and otherwise.

For at least one embodiment, the rivets 105 may be formed by use ofriveting, punch metal, or other known metal processing techniques. Therivets may be positioned at any desired first location(s) on the heatplate 102, as intended for use in securing at least one spring 104 ofcorresponding size and dimension to the heat plate 102. As shown in FIG.2D, a rivet 105A may have a height D6. For at least one embodiment, theheight of a first rivet 105A is the same as the height of a second rivet105B. For at least one embodiment, a first rivet 105A has a differentheight than the second rivet 105B. Each rivet 105A/105B has a desiredradius. For at least one embodiment, the radius of the first rivet 105Ais the same as the radius of the second rivet 105B. For at least oneembodiment, the first rivet 105A has a different radius than the secondrivet 105B. A person of ordinary skill in the art will appreciate thatheight and radius of a rivet used for any given embodiment is commonlydependent upon the thickness and intended use of the materials beingriveted. Accordingly, D6 is not limited to any height or radius.Accordingly, it is to be appreciated that the rivets may have a uniformproperties, such as height and radius, or varying properties and knownacceptable tolerances between rivet properties are well-known by aperson having ordinary skill in the art.

The heat plate 102 may also be configured to include one or more tabs108A/108B extending along one or more second locations, as shown bydesignators L2 and L2A in FIG. 2A, and one or more third locations, asshown by designators L3 and L3A in FIG. 2A, relative to a plane formedby the heat plate 102. It is to be appreciated that the one or moresecond locations and third locations are not fixed locations andgenerally refer to locations relative to the heat plate 102 with respectto which a given tab extends above and/or about and as desired for animplementation of any given embodiment of the present disclosure. Thetabs 108A/108B may be aligned in one or more directions. For at leastone embodiment, the tabs 108 may be used to slidably engage andmechanically connect the spring 104 to the heat plate 102 at each of thesecond and third locations. For at least one embodiment, the tabs 108may be used to thermally couple the spring 104 to the heat plate 102. Asshown in FIG. 1G and for at least one embodiment, a tab 108 may beformed by suitably stamping, punching, and/or bending a portion of theheat plate 102 such that a tab member 108 extends from the surface ofthe heat plate 102. For at least one embodiment, a tab member 108extends a distance D3 such that a tab opening 109 is formed in thesurface of the heat plate 102. A tab 108 may have a length D2. For atleast one embodiment, D2 equals approximately 10 mm. For at least oneembodiment, the length of a first tab 108A is the same as the length ofa second tab 108B. For at least one embodiment, a first tab 108A has adifferent length than the second tab 108B. Further, each tab 108A and108B may be positioned on the heat plate 102 a distance from one or morecorresponding rivets 105 to facilitate the retention of the spring 104on the heat plate 102 while also permitting lateral movement of thespring 104 relative to the heat plate 102 when transitioning from theunassembled state to the assembled state. For at least one embodimentand as shown in FIG. 2D, a tab 108A is a distance D18 from acorresponding rivet 105A, where D18 is measured from the center of therivet 105A to the outer edge of the tab 108A. For at least oneembodiment, D18 is approximately 62 mm.

As shown in FIGS. 1G and 2D, for at least one embodiment, the first tab108A extends a distance D3 above the top surface 102-T of the heat plate102. For at least one embodiment, D3 is approximately 1.50 mm. For atleast one embodiment, each of the first tab 108A and the second tab 108Bextend the same distance D3 above the top surface 102-T of the heatplate 102. For at least one embodiment, the first tab 108A and thesecond tab 108B each extend a different distance above the top surface102-T of the heat plate 102.

As shown in FIG. 2B for at least one embodiment, the first tab 108A hasa width D4. For at least one embodiment, D4 is approximately 3.40 mm.For at least one embodiment, the width D4 of the first tab 108A is thesame as the width D5 of the second tab 108B. For at least oneembodiment, the width D4 of the first tab 108A is different than thewidth D5 of the second tab 108B.

It is to be appreciated, that for at least one embodiment, a tab 108 maybe formed without using one or more metal stamping, punching, andbending processes and instead by attaching separately formed tab membersto the heat plate 102. Such attachment may occur using fasteners,adhesives, metal bonding, any other known processes. When a tab isformed using separate materials, a tab opening 109A may not be presentor formed in the heat plate 102. Likewise, it is to be appreciated thatfor at least one embodiment, rivets may not be utilized to attach thespring 104 to the heat plate 102. Instead and for at least oneembodiment, a corresponding set of second tabs may be used in lieu ofthe rivets to attach each end of the spring 104 to the heat plate 102.

The spring 104 may be sized and configured to abut a surface area of oneor more selected heat generating components 402 in a device 400, FIG.4A. In at least one embodiment, the spring 104 may be sized to abut atop surface 403 of a component 402. The top surface 403 may have anydesired geometric shape. For at least one embodiment, the top surface403 is a substantially flat surface. In other embodiments, the spring104 may be configured to abut and/or contact other surface areas of acomponent 402, such as a bottom, a side, an extension, combinationsthereof, or otherwise.

As discussed above and as shown in FIGS. 3A-3F for at least oneembodiment, the spring 104 may include a first spring member 302, a topspring member 306, and a second spring member 310. For at least oneembodiment, the first spring member 302 is configured to be attached tothe heat plate 102 by the one or more rivets 105. For at least oneembodiment, the top spring member 306 is configured to make physicalcontact with the top surface 403 of the heat generating component 402.The second spring member 310 is configured to make physical contact withthe one or more tabs 108. At least one of the first spring member 302and the second spring member 310 are configured to facilitate thermalconductivity between the heat generating component 402 and the heatplate 102.

For at least one embodiment, the first spring member 302 is connected tothe top spring member 306 by a first connecting member 304. For at leastone embodiment, the first connecting member 304 includes a flat firstconnecting member 304S. For at least one embodiment the first flatconnecting member 304S is substantially flat and is approximately 19 mmlong. Other lengths may be used for other embodiments. For at least oneembodiment, the first connecting member 304 also includes a first springcurvature 303 and a second spring curvature 305. For at least oneembodiment, the second spring curvature 305 is 2.4 mm long. Otherembodiments may utilize different lengths.

For at least one embodiment, at least one of the first spring curvature303 and the second spring curvature 305 are configured to respectivelybend in the vertical direction “Y” to facilitate the vertical deflectionof the spring 104. For at least one embodiment, at least one of thefirst spring curvature 303 and the second spring curvature 305 areconfigured to extend in the horizontal direction “X” to facilitate thehorizontal extension of the spring 104.

For at least one embodiment, the second spring member 310 is connectedto the top spring member 306 by a second connecting member 308. For atleast one embodiment, the second connecting member 308 includes a flatsecond connecting member 308S. For at least one embodiment the secondflat connecting member 308S is substantially flat and has a length ofapproximately 19 mm for at least one embodiment. However, other lengthsmay be used for other embodiments.

For at least one embodiment, the second connecting member 308 includes athird spring curvature 307 and a fourth spring curvature 309. For atleast one embodiment, at least one of the third spring curvature 307 andthe fourth spring curvature 309 are configured to respectively bend, inthe vertical Y direction, to facilitate the vertical deflection of thespring 104. For at least one embodiment, at least one of the thirdspring curvature 307 and the fourth spring curvature 309 are configuredto respectively extend in the horizontal X direction, to facilitate thehorizontal extension of the spring 104. For at least one embodiment, thesecond spring curvature 305 is longer than the third spring curvature307.

For at least one embodiment, at least one of the first spring member302, the top spring member 304, and the second spring member 310 areconfigured to not substantially bend vertically while the spring 104 isvertically deflected while in the transition and assembled states.Instead, any substantial bending and/or deflection of the spring 104occurs in one or more of the first spring curvature 303, the firstconnecting member 304, the second spring curvature 305, the third springcurvature 307, the second connecting member 308, and/or the fourthspring curvature 309. It is to be appreciated that by varying thethickness of the material used at one or more of the above-mentionedmembers of the spring 104, the vertical deflection and/or horizontalextension of the spring 104 during the transition and assembled statesmay be controlled.

For at least one embodiment, the top spring member 306 has a length D13.For at least one embodiment, D13 equals approximately 20 mm.

For at least one embodiment, the top spring member 306 may include oneor more ribs 312 a-312 n which extend above the surface of the topspring member 306. The ribs 312 a-n may be formed using any knowntechnique including but not limited to punching and stamping, metaldeposition, affixing or otherwise. For at least one embodiment, the ribs312 a-n are formed by stamping the top spring member 306 such thatmultiple recesses 313 a-n are formed in the top spring member 306. It isto be appreciated that when stamped into the top spring member 306, anddepending on whether shown in a top, bottom or other view, theorientation of the ridges 312 a-n and recesses 313 a-n will vary. For atleast one embodiment, a ridge extends a height D14 above the bottom ofthe recesses 313 a-n. For at least one embodiment, D14 is approximately0.70 mm. For at least one embodiment, D14 is a uniform height for eachridge and any adjacent recess(es) on the top spring member 306. For atleast one embodiment, D14 may vary with respect to any given pairing ofa ridge 312 and a recess 313. For at least one embodiment, seven ridges312 a-n are formed on the top spring member 306. It is to be appreciatedthat any number of ridges 312 and recesses 313 may be used for any givenimplementation of an embodiment of the present disclosure. For at leastone embodiment, the ribs 312 a-312 n are oriented on the top springmember 306 substantially parallel to a length of the spring 104, wherethe length is in the “X” direction shown in FIG. 3B. Other orientationsof the ribs 312 a-312 n may be used for other embodiments. For at leastone embodiment, the ribs 312 a-312 n are oriented on the top springmember 306 to provide a substantially flat contact surface whenpositioned relative to a top surface 403 of the component 402 when thedevice 400 is in the assembled state. For at least one embodiment, theribs 312 a-312 n are oriented on the top spring member 306 to preventelectrical contact between the spring 104 and the component 402 when thedevice is in the assembled state.

For at least one embodiment, the top spring member 306 may include ametal block (not shown). For at least one embodiment, the ribs 312 a-nmay be used in place of and/or in addition to a metal block. It is to beappreciated that a combination of a metal block and ribs may be used inaccordance with at least one embodiment of the present disclosure. Thelayout of such metal block and/or ribs may vary based upon the shape andconfiguration of the top spring member 306 and the shape andconfiguration of a top surface 403 of the component 402.

For at least one embodiment, the spring 104 may include a tab slot 314.For at least one embodiment, a tab slot 314 is sized to correspond tothe dimensions of a given tab 108 on a heat plate 102 such that desiredamount of vertical and horizontal pressure arises between the given tab108 and the given tab slot 314, such vertical and horizontal pressuresbeing sufficient to provide a desired mechanical and thermal connectionbetween the spring 104 and the heat plate 102. It is to be appreciatedthat the sizing of a given tab slot 314 relative to a given tab 108 mayvary from embodiment to embodiment and will generally arise within apre-determined range of tolerances. For at least one embodiment, the tabslot has a length D16 and a width D17. For at least one embodiment, D16is approximately 4 mm and D17 is approximately 2.75 mm.

As discussed above, the spring 104 may be mechanically attached to heatplate 102 by one or more rivets 105, such as rivets 105A and 105B. Asdiscussed above and further shown in FIGS. 2D and 2C, the rivets 105Aand 105B may be punched into the heat plate 102 prior to attachment ofthe spring 104 to the heat plate 102. As shown in FIGS. 1A and 3A, therivets 105 may be configured to extend into a rivet opening 106A/106B inthe first spring member 302. The one or more rivet openings 106 may besized and configured using known and conventional riveting principlesand techniques. The spring 104 may be attached to the heat plate 102 byaligning the rivet openings 106 with the rivets 105 and pressing thefirst spring member 302 onto the heat plate 102. To facilitate suchriveting, rivet tool openings 107A/107B may be provided in the firstspring connecting member 304. For at least one embodiment, the rivettool openings 107 are optional and a suitable press tool or othertechniques may be used to press the one or more rivet openings 106 ontothe rivets 105 and thereby attach the first spring member 302 to theheat plate 102. It is also to be appreciated that for other embodiments,the spring 104 may be attached to the heat plate 102 using other knowntypes of connections, such as mechanical, adhesive, metal bonds,combinations thereof, or otherwise. Further, it is to be appreciatedthat any number of rivets or other connectors may be utilized to attachthe first spring member 302 to the heat plate 102. For at least oneembodiment, the first spring member 302 may be attached to the heatplate using one or more tabs 108 on the heat plate 102 and one or moretab slots 314 in the spring 104.

For at least one embodiment, the spring 104 is constructed from coppermetal and has a thickness of approximately 0.4 mm. For at least oneembodiment, the spring 104, when in the non-assembled state, has alength D7 of approximately 63 mm, a width D8 of approximately 20 mm, aheight D9 of approximately 5 mm, a gap D10 of approximately 42 mmbetween the end of the first spring member 302 and the end of the secondspring member 310, a thickness D11 of approximately 0.5 mm, a height D12of approximately 3 mm, and a height D15 of approximately 8.0 mm. It isto be appreciated that other materials, lengths, widths and/orthicknesses thereof may be used for any given implementation of anembodiment of the present disclosure. For at least one embodiment, thespring 104 may be configured to vertically deflect, between 1 and 4 mmas measured at either of the first spring curvature 303 or the fourthspring curvature 309, in relation to the spring 104 in an unassembledstate versus an assembled state. It is to be appreciated that otherextensions and/or vertical deflections of the spring 104 may arise whenthe spring 104 is used for any given implementation of an embodiment ofthe present disclosure.

As shown in FIGS. 4A and 4B, the spring 104 may be configured to conformto at least two corresponding shapes arising under at least two states:an unassembled state, as shown in FIG. 4A, and an assembled state, asshown in FIG. 4B. For the unassembled state, the spring 104 may beconfigured to have an expanded configuration, such that the spring 104is not under pressure and is not extended longitudinally or deflectedvertically relative to a first plane formed by the heat plate 102.

As shown in FIG. 4B, when in the assembled state, the spring 104 isconfigured into a second form, where the spring 104 is compressedvertically and extended laterally. While the spring 104 transitions fromthe unassembled state to the assembled state, a transition state occurs.During the transition state, pressure applied to the top enclosure 408is transferred to the spring 104 while the spring 104 begins to contact,and while remaining in contact with, the heat generating component 402.Such pressure is absorbed, at least in part, by lateral extension, asrepresented by V3, and vertical deflection, as represented by V2, of thespring 104. It is to be appreciated that the amount of extension anddeflection of the spring 104 may be pre-determined by a person havingordinary skill in the art in view of the properties chosen for a givenspring 104 and that such properties may be selected such that anyextension and deflection of the spring 104 when in the assembled stateprovides the desired amount of pressure by the spring 104 on the heatgenerating component 402. For at least one embodiment, the spring 104may be configured to fill, substantially, completely, or partially, oneor more gaps that would otherwise exist, absent use of the spring 104,between the heat plate 102 and the heat generating component 402 whenthe device 400 is in the assembled state.

For at least one embodiment, the use of the tabs 108 on the heat plate102 and tab openings 109 on the spring 104 to attach at least one end ofthe spring 104 to the heat plate 104 may facilitate translation of avertical force V1 on the spring 104 into a lateral force V3 and a secondvertical force V2, where V2 is less than V1. That is, the second springmember 310 (as shown in FIGS. 3A-3F) will further extend under andtowards the tabs 108 such that the tab slots 314 shift from the secondlocation to the third location when in the device 400 transitions fromthe unassembled state to the assembled state. The spring 104 willmaintain this extended form during the assembled state. It is to beappreciated that the extension of the spring 104 results in absorptionof some of the vertical force V1 applied to the spring 104 during thetransition and assembled states. Such extension of the spring 104enables the spring 104 to fill any gap without inducing a crimping orbending of the spring 104 at or about the area of contact of the spring104 with the desired contact surface on the component 402.

More specifically and for at least one embodiment, during the transitionstate and while the top enclosure 408 is being affixed and remainsaffixed, during the assembled state, to the bottom enclosure 410, aforce V1 is applied, via the spring 104 onto the component 402. For atleast one embodiment, the spring 104 design of the present disclosureenables the heat spreader 100 to translate the force V1 into at leasttwo force components: a lateral force V3 and a second vertical force V2.It is to be appreciated that V1 is a function of V2 and V3, and thevalues of V2 and V3 will vary based on the properties of the spring 104chosen for any given embodiment. Likewise, the value of V1 will varybased on the amount of force applied by the spring 104 on the component402 during assembly of the device 400 and while the device is assembled.It is to be appreciated that such force V1 may vary based on the size ofthe actual gap 416 to be covered by the spring 104 versus the actual gapencountered for any given implementation, the thickness of the spring104 and other known factors.

Further, for at least one embodiment, the relative direction of thelateral force V3 may be defined by a plane formed by the area of thespring 104 in contact with the component 402 during the transition andassembled states. It is to be appreciated, that such lateral force neednot arise in relation to a fixed geometric coordinate system, such as asystem defined by a plane formed by a portion of the top enclosure 408or the bottom enclosure 410 of the device 400, and may arise at anyrelative orientation thereto.

For at least one embodiment, the heat spreader 100 may include use of athermal pad 416 that can be affixed to the top spring member 306. Inaccordance with at least one embodiment, the thermal pad 416 includes asilicone elastomer with thermal conductivity properties of approximately7.0 W/mK over a temperature range of approximately 40 to 160 degreesCelsius. For at least one embodiment, the thermal pad 416 has athickness of approximately 0.5 mm with a thickness tolerance of 20%. Forat least one embodiment, the thermal pad 416 may be sized to thedimensions of the top spring member 306. Other embodiments may usethermal pads having different characteristics and size, as desired forany given implementation of an embodiment of the present disclosure. Theuse, configuration and properties of thermal pads are well-known in theart and the present disclosure is not limited to any given type ofconfiguration of thermal pad.

For at least one embodiment, a method of assembling the heat spreader100 may include first stamping and configuring the heat plate 102 toinclude the one or more rivets 105 and the one or more tabs 108. Theoperations may include configuring the spring 104 to have the desiredmembers, including the first spring member, second spring member, topspring members and the connecting and curvature members. The operationsmay include fabricating the members to have a desired thickness. Theoperations may include, when riveting is utilized to mechanicallyconnect the spring 104 to the heat plate 102, forming a rivet opening106 and a rivet tool opening 107. The operations may include fabricatingthe spring 104 to include at least one tab slot 314. The operations mayinclude fabricating the top spring member to include one or more ribs312. The operations may include positioning the spring 104 on the heatplate 102 by inserting each tab 108 into a corresponding tab slot 314such that the tab slot 314 corresponds to the tab 108 at the secondlocation. The operations may include attaching the first spring member302 to the heat plate 102. For at least one embodiment, such attachmentmay occur by positioning a rivet opening 106 on a spring 104 above acorresponding rivet 105 on a heat plate 102 and using compressive forcesto rivet the spring 104 to the heat plate 102. For at least oneembodiment, attachment of a first spring member 302 to a heat plate 102may occur using at least one of mechanical fasteners, adhesives, andmetal bonding.

An embodiment of the present disclosure may use one or more of the aboveoperations and other operations to provide a heat spreader 100 for usein a device to transfer heat from a component in the device. The use ofsuch a heat spreader 100 may include the operations of positioning theheat spreader 100 in a first portion of the device, such as a topenclosure, such that a spring 104 on the heat spreader is aligned abovea component 402 in the device, wherein the component is position in abottom enclosure 410. The operations may also include applying adownward force on the top enclosure while it is aligned with the bottomenclosure such that corresponding force is exerted by the spring 104onto the component, wherein the spring translates the downward force 104into a horizontal force that results in an extension of the spring and asecond downward force that results in a vertical deflection of thespring. The extension of the spring 104 results in an extension of thespring such that the tab slot 314 shifts from the second location to thethird location, wherein while positioned at and transitioning betweeneach of the second and third locations each tab slot 314 maintainsphysical contact with a corresponding tab 108 on the heat plate 102.Continuing to apply the downward force until the top enclosure ispositioned relative to the bottom enclosure such that the device is inan assembled state. And, securing the top enclosure to the bottomenclosure. The securing of the top enclosure to the bottom enclosure mayoccur using any known methods and components.

The various embodiments of the present disclosure also provide for anassembled electronic device wherein heat from a component in such deviceis transferred by a heat spreader configured according to the abovedescription.

Although various embodiments of the claimed invention have beendescribed above with a certain degree of particularity, or withreference to one or more individual embodiments, those skilled in theart could make numerous alterations to the disclosed embodiments withoutdeparting from the spirit or scope of the claimed invention. The use ofthe terms “approximately” or “substantially” means that a value of anelement has a parameter that is expected to be close to a stated valueor position. However, as is well known in the art, there may be minorvariations that prevent the values from being exactly as stated.Accordingly, anticipated variances, such as 10% differences, arereasonable variances that a person having ordinary skill in the artwould expect and know are acceptable relative to a stated or ideal goalfor one or more embodiments of the present disclosure. It is also to beappreciated that the terms “top” and “bottom”, “left” and “right”, “up”or “down”, “first”, “second”, “before”, “after”, and other similar termsare used for description and ease of reference purposes only and are notintended to be limiting to any orientation or configuration of anyelements or sequences of operations for the various embodiments of thepresent disclosure. Further, the terms “and” and “or” are not intendedto be used in a limiting or expansive nature and cover any possiblerange of combinations of elements and operations of an embodiment of thepresent disclosure. Other embodiments are therefore contemplated. It isintended that all matter contained in the above description and shown inthe accompanying drawings shall be interpreted as illustrative only ofembodiments and not limiting. Changes in detail or structure may be madewithout departing from the basic elements of the invention as defined inthe following claims.

What is claimed is:
 1. A heat spreader, configured to operativelydissipate heat from a heat generating device component, comprising: aheat plate-comprising: a top surface including at least a firstlocation, a second location, and a third location; and a springcomprising: a first spring member; and a second spring member; whereinthe first spring member is attached to the heat plate at the firstlocation; wherein the second spring member attaches the spring to theheat plate at the second location, when the spring is compressed by theheat generating device component; and wherein the second spring memberattaches the spring to the heat plate at the third location, when thespring is not compressed by the heat generating device component.
 2. Theheat spreader of claim 1, wherein the heat plate further comprises: afirst fastener; and a second fastener; wherein the first fastener firstattaches the spring to the heat plate at the first location; and whereinthe second fastener second attaches the spring to the heat plate betweeneach of the second location and the third location.
 3. The heat spreaderof claim 1, wherein each of the second location and the third locationare distinct locations above the top surface of the heat plate.
 4. Theheat spreader of claim 3, wherein the heat plate further comprises: atab extending above the top surface and between the second location andthe third location.
 5. The heat spreader of claim 4, wherein the springthermally couples the heat plate to the heat generating device componentwhen the spring is operatively compressed and thermally decouples theheat plate from the heat generating device component when the spring isnot operatively compressed.
 6. The heat spreader of claim 1, wherein thespring further comprises: a top spring member, connecting the firstspring member with the second spring member, comprising: a firstconnecting member; and a second connecting member.
 7. The heat spreaderof claim 6, wherein the first connecting member comprises: a firstspring curvature which deflects when compressed; wherein the secondconnecting member comprises: a fourth spring curvature which extendswhen compressed.
 8. A heat spreader, configured to operatively dissipateheat from a heat generating device component, comprising: a heat platecomprising: a top surface including at least a first location, a secondlocation, and a third location; and a spring comprising: a first springmember attached to the heat plate at the first location; and a secondspring member; wherein the second spring member attaches the spring tothe heat plate at the second location, when the spring is compressed bythe heat generating device component; and wherein the second springmember attaches the spring to the heat plate at the third location, whenthe spring is not compressed by the heat generating device component;wherein the heat plate further comprises a tab; and wherein the secondspring member further comprises a tab slot configured to operativelyaccept the tab.
 9. The heat spreader of claim 8, wherein the springfurther comprises: a top spring member, connecting the first springmember with the second spring member, comprising: a first connectingmember; and a second connecting member.
 10. The heat spreader of claim9, wherein the first connecting member comprises: a first springcurvature; and a second spring curvature.
 11. The heat spreader of claim10, wherein the first spring curvature deflects when compressed.
 12. Theheat spreader of claim 9, wherein the second connecting membercomprises: a third spring curvature; and a fourth spring curvature. 13.The heat spreader of claim 12, wherein the fourth spring curvatureextends when compressed.
 14. The heat spreader of claim 8, wherein thespring thermally couples the heat plate to the heat generating devicecomponent when the spring is operatively compressed and thermallydecouples the heat plate from the heat generating device component whenthe spring is not operatively compressed.
 15. A heat spreader,configured to operatively dissipate heat from a heat generating devicecomponent, comprising: a heat plate comprising: a top surface includingat least a first location, a second location, and a third location; anda spring comprising: a first spring member attached to the heat plate atthe first location; a second spring member; wherein the second springmember attaches the spring to the heat plate at the second location,when the spring is compressed by the heat generating device component;and wherein the second spring member attaches the spring to the heatplate at the third location, when the spring is not compressed by theheat generating device component; and a top spring member, connectingthe first spring member with the second spring member, comprising: atleast two ribs; wherein, when the spring is operatively compressed bythe heat generating device component, the at least two ribs operativelycontact a top surface of the heat generating device component, and thespring thermally couples the heat plate to the heat generating devicecomponent.
 16. The heat spreader of claim 15, wherein the top springmember further comprises: a first connecting member comprising a firstspring curvature and a second spring curvature.
 17. The heat spreader ofclaim 16, wherein the top spring member further comprises: a secondconnecting member comprising a third spring curvature and a fourthspring curvature.
 18. The heat spreader of claim 17, wherein at leastone of the first spring curvature and the third spring curvaturedeflects when compressed.
 19. The heat spreader of 17, wherein at leastone of the second spring curvature and the fourth spring curvatureextends when compressed.
 20. The heat spreader of claim 15, wherein thespring thermally couples the heat plate to the heat generating devicecomponent when the spring is operatively compressed and thermallydecouples the heat plate from the heat generating device component whenthe spring is not operatively compressed.